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25D package cross section

Access to the Latest Packaging Techniques

The drive to integrate more functionality and performance is driving advanced packaging techniques such as 2.5D and 3D package architectures.

2.5D / 3D packaging allows ICs to be integrated vertically.  Traditional flip-chip packaging requires each IC to be packaged individually and integrated with other ICs via traditional circuit board technologies. 2.5D packaging puts die closer together and with smaller bumps using silicon interposers to connect to standard packaging technology. 3D packaging takes the 2.5D packaging and goes further to stack the die vertically for even shorter connections between die.  By directly integrating ICs in this manner, inter-IC communication interfaces can often be reduced or eliminated altogether. This can improve both performance and reduce weight and power.

This packaging sophistication requires novel assembly and test techniques.  Tektronix Component Solutions is partnering with industry technology leaders to bring these latest packaging developments to the mission-critical applications of the defense and aerospace industries.

Military electronic warfare jet

As a proven US-based, ITAR-registered supplier to a variety of defense programs and companies, Tektronix Component Solutions is an ideal partner for defense applications requiring high-performance, mission-critical microelectronics. Offering services and products that include wafer test, IC packaging assembly and test, 2.5/3D packaging, and design & simulation, Tektronix Component Solutions has the expertise and capabilities to meet your requirements for high-reliability microelectronics.

With more than 40 years of experience, Tektronix Component Solutions is the stable supplier that you can trust to deliver on long-term military programs.

Trusted, ITAR-Registered Supplier

Tektronix Component Solutions has been accredited by the U.S. Department of Defense (DOD), Defense Microelectronics Agency (DMEA) as a Category 1A microelectronics Trusted Source for IC packaging/assembly and test services – the highest designation awarded by the U.S. Department of Defense. This enables Tektronix Component Solutions to serve U.S. defense customers with classified program requirements. The accreditation certifies that Tektronix Component Solutions meets stringent product control and security standards in providing trusted microelectronic services. Tektronix Component Solutions also holds certifications in ISO9001/ISO14001 and AS9100D and meets all ITAR requirements.

As an on-shore, ITAR-registered supplier, Tektronix Component Solutions has stringent standards in-place to protect and control sensitive information related to defense programs. With many years of experience supporting defense customers and programs, we recognize and adhere to the added level of responsibility in providing microelectronic engineering and manufacturing services to the military.

DOD DMEA logos

High-Performance Products and Services

Our military experience spans a variety of critical applications, including communications, avionics, radar, propulsion control, and guidance systems. Tektronix Component Solutions has supplied high-performance and high-reliability products to defense programs such as the F-22 Raptor and F-35 Lightning II (Joint Strike Fighter) with a focus on continual C-SWaP (cost, size, weight and power) improvements.

Having served military and commercial aerospace customers for many years, Tektronix Component Solutions has a deep understanding of the high-reliability requirements of those applications. As such, we fully utilize our unique strength in test to deliver fully-tested parts that have proven to operate successfully in mission-critical environments.

Tektronix Component Solutions has a team of engineers ready to help you solve your most complex design, packaging, and test challenges. Contact us at [email protected], 1-800-462-9835, or use the form to the right, to discuss how we can help.

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