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Tektronix Component Solutions: Multi-Chip Modules

Incorporating multiple integrated circuits (ICs) into a single device, multi-chip modules offer benefits in device size and performance. By shortening the signal-path between ICs, and using a common high-performance substrate material, multi-chip modules can improve device operation while managing size and weight constraints.

As a high-performance IC packaging and hybrid circuit provider, Tektronix Component Solutions has designed, assembled and tested a variety of multi-chip modules. With proven experience developing custom solutions for a variety of advanced applications, our multi-chip modules can help product developers achieve next-generation performance levels.

Substrate Technology

Our design and assembly experience with a variety of substrate technologies provides the flexibility to select the appropriate technology for your multi-chip module. Whether you're looking for a ceramic multi-chip module (MCM-C), a laminate MCM solution (MCM-L) or a deposited MCM using thin film technology (MCM-D), our broad base of experience can support your custom requirements. Our substrate design and assembly experience includes, but is not limited to, the following technologies:

  • Glass-epoxy laminate (e.g., FR4, BT)
  • Thick-film ceramic
  • Thin-film ceramic
  • High-Temperature Co-fired Ceramic (HTCC)
  • Low-Temperature Co-fired Ceramic (LTCC)
  • Beryllium Oxide (BeO)
  • Specialty substrates

Assembly Capabilities

With a broad base of IC package assembly capabilities, Tektronix Component Solutions can manufacture a custom multi-chip module with an appropriate interconnect technology for your application. Whether you require wire bond interconnects, a multi-chip BGA solution or direct attach of multiple chips onto a flex substrate, we are able to manufacture a solution to meet your particular requirements.