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Tektronix Component Solutions: CLCC Packages

CLCC packages (ceramic leadless chip carriers) provide a lower-cost, Surface Mount Technology (SMT) compatible IC package solution. Well-suited for devices with low wire-bond / pin count configurations, CLCC packages have proven to be a viable solution for a variety of applications.

To meet the broadband performance requirements of telecommunications systems, military and aerospace applications, Tektronix Component Solutions offers a 40 GHz Ceramic Leadless Chip Carrier packaging platform. The CLCC platform provides a means to achieve next-generation performance in product development while managing aggressive design goals for hermeticity and reductions in size, weight and power (SWaP).

40 GHz CLCC Specifications:

  • High-Temperature Co-Fired Ceramic (HTCC) Package
  • Wire-bond interconnect for low pin-count ASICs (≤ 40 pins)
  • DC to 40 GHz bandwidth (RL ≤-10 dB, IL ≥ -1.5 dB)
  • Solder-sealable for MIL-STD-883 compliance (Methods 1014 & 1018.6)
  • Optional embedded CuMo slug for improved power dissipation

40 GHz CLCC Case Study (PDF)

Typical Applications:

  • 40G & 100G Communications
  • Military & Aerospace
  • Terrestrial Communications
  • Instrumentation
  • Automated Test Equipment