What is the most straightforward way for me to determine if my open occurred in the package or in the die?

What is the most straightforward way for me to determine if my open occurred in the package or in the die?

One of the key impedance profile features differentiating an open fault in the package or bondwire from an open fault in the die itself is a characteristic dip of an input die capacitance before an open, and indicating a good connection to the die. If this signature dip is present, then the package connection is working properly.