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Supporting high-performance microelectronics throughout the product life-cycle
When it comes to managing and supporting high-performance, high-reliability microelectronics, Tektronix Component Solutions has the deep knowledge and breadth of experience across all the stages of component life-cycle to fully-manage your custom microelectronic solution. Our capabilities for custom components extend beyond design, assembly and test services to also include supply chain management, reliability testing and failure analysis services. Once a product has moved from development into production, our team's primary goal is to ensure supply stream consistency and the timely delivery of quality components.
From ensuring delivery of finished wafers through our relationships with a variety of foundries, to bill-of-materials (BOM) management, Tektronix Component Solutions offers complete supply-chain management services for custom microelectronic assemblies. Utilizing in-house ASIC and IC package design expertise, advanced lean manufacturing capabilities, comprehensive test services and supply-chain management, Tektronix Component Solutions can serve as the single point of contact for your next-generation components.
Reliability & Failure Analysis
As a supplier to the aerospace, military and medical markets, delivering high-reliability parts is a key requirement. Tektronix Component Solutions has extensive experience in the design and assembly of parts to meet the reliability needs of demanding applications. Additionally, we have developed the in-house expertise to perform industry standard reliability testing, evaluating parts with a variety of environmental and mechanical stress factors. For failure analysis, our lab offers a wide array of capabilities including, but not limited to, scanning acoustic microscopy (SAM), x-ray, scanning electron microscopy (SEM) and elemental analysis. The Tektronix Component Solutions reliability team stands ready to evaluate new designs using one or more of the industry standard environmental testing methods.