The big news for Tektronix at the APEC 2019 Conference next week will be a new solutions kit for SiC MOSFET and GaN FET switching power conversion testing. Tektronix offers the only solution on the market that can accurately characterize all the critical parameters for optimizing power electronics topologies that use wide bandgap Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductors.
These semiconductor materials are a true game changer in power electronics. These devices are capable of operating at much higher switching speeds, voltages and frequencies than typical semiconductors and therefore are seeing growing adoption in a wide range of industrial applications. However, testing and optimization can be notoriously difficult.
At APEC in Booth 471, Tektronix will be demonstrating how our differential probing solution, , as part of the new solutions kit, enables accurate and clear differential measurements that were nearly impossible to make previously. The new solutions kit gives power engineers everything they need to quickly boost productivity and gain new insights.
Tektronix will also have additional live demonstrations focused around power integrity, EMI troubleshooting and compliance, and proper probing techniques.
In addition, Tektronix is hosting two technical presentations:
Topic: Challenges with Testing SiC/GaN Power converters
Presenter: Technical Seminar Keynote Speaker, Seshank Malap
Time: Tuesday, March 19, 1:30-2:00 p.m.
Location: Room 303CD
Topic: Solving the Energy Harvesting and IoT Power Consumption Measurement Challenges
Presenter: Technical Seminar Keynote Speaker, Pat Hensley
Time: Wednesday, March 20, 2:00-5:00 p.m.
Location: Part of IS15/APEC - IEEE PELS Session
Taking place March 17-21 in Anaheim, California, APEC is the premier global event in applied power electronics and brings together more than 4,500 professionals from around the world for five days of networking, hands-on learning, and strategic business development.
Look forward to seeing you there.