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Welcome to Tektronix Semiconductor Testing Platform

Breakthroughs in semiconductor materials bring about a technological revolution and lead to the development and development of cutting-edge new devices. 3DFlash memory, artificial intelligence chips, MEMS/ sensor chips, GaN / SiC power semiconductor devices are driving the development of the semiconductor industry in unprecedented applications.

New application standards, new material properties, new design and testing methods, new production processes, and new semiconductor chip technology continue to pose challenges to test equipment and technology. Tektronix, as a professional test platform, will take you from the perspective of testing, cut out six types of test flow, to analyze and solve a series of new problems brought about by semiconductor from design to production

Semiconductor Design Workflow

Process Design/Material Evaluation/Modeling(R&D) Reliability Analysis Process Control Monitoring (PCM/TEG Test) Wafer Acceptance Test/Die Sort (WAT/KGD/Parametric test) Package-part Functional Test Failure Analysis
Evaluating novel devices/materials and determining whether they can improve characteristics of circuits Trying to determine if device will last for lifetime of intended application/end environments. This is a statistical test so you need to test lots of devices ("good enough" precision) Providing feedback to manufacturing that the process is not deviating from its centerpoint. Need to reduce variability. Usually in foundaries - testing the wafer and showing that it meets the criteria for shipment. (Proof point that it works. Foundaries don't do functional test). Test of discrete devices/final test for companies that make single devices (transitor/VCSEL/etc). This is a niche test dependent on the type of end device. Collecting and analyzing data to determine the cause of a device failure; determine corrective actions or liability

Have You Experience This?

pain-point-1

Different kind of material with unique characterization. A measurement span of several orders of magnitude.

Application: Wide Bandgap semiconductor material

  • Needs a high-voltage source meter at most of few thousands "V"
  • Needs a current source meter with tens of "A"
  • Required accuracy as high as "fA" and "μV" level
pain-point-2

New test methods and requirements require high compatibility of instruments and equipment

Application: Memristor Unit

  • Atom level characterization
  • "ps" level pulse erasure and signal capture
  • High accuracy level of I-V testing and ultra-high speed pulse testing at same time
pain-point-3

Always need more throughput. A large number of repeated tests, each small error will lead to inaccurate results.

Application: Brain Computing

  • More nodes in neural network, more complex testing required
  • Large-scale array automatic testing
Nano Materials

Nano materials are a new generation of materials composed of nano particles with sizes between atoms, molecules and macro systems. It can be classified into metal nano materials, semiconductor nano materials, organic polymer nano materials and composite nano materials.

Wide bandgap semiconductor material

Wide bandgap materials refer to semiconductor materials with a band gap width greater than 2.3ev, which are mainly composed of III-V materials such as SiC and GaN, and are widely used in radio frequency, ultra-high voltage application, such as ultra-high voltage transmission and electric vehicle charging.

New generation of high-speed memory unit, brain computing and neural network

Neural network is a non-linear complex network system composed of a large number of processing units similar to neurons. It is proposed on the basis of modern neuroscience research results. It attempts to complete the information processing function like human brain by simulating the way of processing and memorizing information of brain neural network, which is the cornerstone of brain like computing.

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