Enabling performance, reliability and quality in complex microelectronics
Tektronix Component Solutions offers turnkey IC packaging services for custom, high-performance and high-reliability microelectronics. This includes a full range of design, lean manufacturing and test services for a variety of applications.
Our turnkey services are bolstered by our experience in a variety of IC package material technologies (ceramic, organic and teflon), die attach methodologies (solder, epoxy and eutectic), hermetic devices, and IC package and interconnect technologies including, but not limited to:
IC Packaging Technology Capabilities:
With an experienced team of in-house electrical and mechanical engineers, Tektronix Component Solutions offers full IC package design, simulation and analysis services for high-performance and high-reliability applications. Focusing on manufacturability and testability, our packages are designed to meet your requirements for performance, signal integrity, thermal management and high-density layout. With specialized capabilities in high-speed, high-power package design and experience designing in a variety of substrate technologies, our design team can develop a fully-custom design, or modify an existing design, to meet your high-performance requirements.
All IC packaging is done in Tektronix Component Solutions' manufacturing facility in Beaverton, Oregon, which supports volumes ranging from a few hundred to 100,000 units per year. Our manufacturing line is optimized for lean manufacturing, with 18 lean cells spread throughout our 32,000 feet of Class 10K clean room. In support of our defense customers, we are an ITAR-registered facility and accredited Trusted Supplier. We are also a RoHS-compliance capable supplier.
Rapid prototyping services are also available for faster validation of IC package designs, speeding the transition to full production.
Since our inception as Tektronix' hybrid components group, test has always been an integral part of our capabilities and a unique strength. We offer full IC package testing, including wafer test services to improve die yield, therefore reducing scrap cost. Analog, digital, and mixed-signal semiconductor test are also offered with the goal of ensuring each unique component achieves its performance goals.