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Advanced microelectronics for demanding applications
With over 40 years of experience providing high-performance, high-reliability components for a variety of applications, Tektronix Component Solutions is the microelectronics partner you can rely on to enable your next-generation development project.
We are a US-based, ITAR-registered and accredited Trusted Supplier serving the following markets:
Tektronix Component Solutions is an expert at high-performance microelectronic development and has proven proficiencies in high-speed communications applications. For example, we offer 15 and 30+ GHz BGA (ball grid array) and 40+ GHz LCC (leadless chip carrier) packaging platforms, qualified specifically with the needs of communications and defense customers in mind. Additionally, we provide turn-key services—design, assembly and test—for electro-optical modules. Our optical experience includes development of a proprietary prism that bends the optical path to enable a lower profile for an optical transceiver device. Adding to our IC packaging and hybrid development capabilities, our high-speed data converter modules, leveraging propietary Tektronix technology, support the needs of high-speed communications applications.
As a Category 1A Trusted Supplier for assembly and test services and an ITAR-registered organization, Tektronix Component Solutions is an ideal partner for defense applications requiring low-volume, high-performance microelectronics. Our defense experience spans a variety of applications, including communications, avionics, radar, propulsion control, guidance systems and other types of sensors and seekers. Additionally, Tektronix Component Solutions is a proven supplier to the military, supplying strategic programs such as the F-22 Raptor and the F-35 Lightning II (Joint Strike Fighter).
Our broad base of high-performance and high-reliability microelectronics capabilities is suitable for a variety of life science applications. Our experience designing in a variety of substrate technologies enables us to select and design the appropriate material for your particular life science application. In addition, we’re experts at precision wire-bonding, a dominant interconnect technology across life science applications, and utilize either gold or aluminum wire-bond material to support a device’s performance and reliability requirements.
Tektronix Component Solutions has nearly two decades of experience supplying custom, high-reliability parts for medical imaging applications and actively manufactures multi-chip packaging solutions for digital x-ray and mammography systems. Our advanced wire-bond capabilities ensure precision wire-placement, even in high-density devices and our custom test solutions verify that assembled components meet the demanding requirements to support the high-resolution capabilities of medical imaging systems.
Providing microelectronic technology development for Tektronix’ instruments, Tektronix Component Solutions is constantly pushing the boundaries of performance. Our ASIC designers are experts at developing high-speed devices for signal acquisition, conditioning, processing and generation. These skills, combined with our IC packaging or RF/microwave capabilities, consistently enables the performance of next-generation measurement systems. These same capabilities are applicable to the development of advanced automated test equipment (ATE) systems.